* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Function |
Applications |
Number of Channels |
Interface |
Voltage - Supply |
Operating Temperature |
Specifications |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
IC AUDIO DECODER 6+2CH 80-TQFP
|
Package: 56-VFQFN Exposed Pad |
Stock8,352 |
|
56-VFQFN Exposed Pad |
- |
Fully Integrated Processor |
Pre-Amplifier |
8 |
I2C, I2S |
3 V ~ 3.6 V |
-40°C ~ 125°C (TJ) |
Full Flexible Amplification |
56-VFQFN Exposed Pad |
56-VFQFPN (8x8) |
||
STMicroelectronics |
IC AUD PROCESSOR 2.1MULTI 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock2,976 |
|
28-SOIC (0.295", 7.50mm Width) |
- |
Fully Integrated Processor |
Pre-Amplifier |
3 |
I2C, I2S |
3 V ~ 3.6 V |
-20°C ~ 125°C (TJ) |
Direct Digital Amplification |
28-SOIC (0.295", 7.50mm Width) |
28-SO |
||
STMicroelectronics |
IC AUDIO SYSTEM DGTL 4CH 64-LQFP
|
Package: 64-LQFP Exposed Pad |
Stock22,584 |
|
64-LQFP Exposed Pad |
Sound Terminal™ |
Fully Integrated Processor |
Pre-Amplifier |
8 |
I²C, I²S |
3 V ~ 3.6 V |
-40°C ~ 125°C (TJ) |
Full Flexible Amplification |
64-LQFP Exposed Pad |
64-LQFP-EP (10x10) |
||
STMicroelectronics |
IC AUDIO PROCESSOR 8CHAN TQFP64
|
Package: 64-LQFP |
Stock2,656 |
|
64-LQFP |
- |
Fully Integrated Processor |
Pre-Amplifier |
8 |
I2C, I2S |
3 V ~ 3.6 V |
-40°C ~ 125°C (TJ) |
Full Flexible Amplification |
64-LQFP |
64-TQFP (10x10) |
||
STMicroelectronics |
IC AUDIO PROCESSOR 8CHAN 64TQFP
|
Package: 64-LQFP |
Stock3,424 |
|
64-LQFP |
- |
Fully Integrated Processor |
Pre-Amplifier |
8 |
I2C, I2S |
3 V ~ 3.6 V |
-40°C ~ 125°C (TJ) |
Full Flexible Amplification |
64-LQFP |
64-TQFP (10x10) |
||
STMicroelectronics |
IC AUDIO PROCESSOR 8CHAN TQFP64
|
Package: 64-LQFP |
Stock6,992 |
|
64-LQFP |
- |
Fully Integrated Processor |
Pre-Amplifier |
8 |
I2C, I2S |
3 V ~ 3.6 V |
-40°C ~ 125°C (TJ) |
Full Flexible Amplification |
64-LQFP |
64-TQFP (10x10) |
||
STMicroelectronics |
IC AUDIO SYSTEM DGTL 4CH 64-LQFP
|
Package: 64-LQFP Exposed Pad |
Stock6,944 |
|
64-LQFP Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
4 |
I2C, I2S |
2.5 V ~ 3.6 V |
0°C ~ 70°C (TA) |
Full Flexible Amplification |
64-LQFP Exposed Pad |
64-LQFP EP (10x10) |
||
STMicroelectronics |
IC AUDIO SYSTEM DGTL 36POWERSOIC
|
Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
Stock98,964 |
|
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
- |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
8 V ~ 36 V |
-40°C ~ 125°C (TJ) |
Direct Digital Amplification |
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
PowerSO-36 |
||
STMicroelectronics |
IC AUDIO SYSTEM 2.1 36POWERSOIC
|
Package: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
Stock226,860 |
|
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
- |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
10 V ~ 36 V |
-40°C ~ 125°C (TJ) |
Direct Digital Amplification |
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
PowerSO-36 EPU |
||
STMicroelectronics |
IC DAS 2CH MICROLESS POWERSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock539,688 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 21.5 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |
||
STMicroelectronics |
IC DAS 1CH SOUND POWERSSO36
|
Package: - |
Stock2,080 |
|
- |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 21.5 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
- |
- |
||
STMicroelectronics |
IC DAS 2CH MICROLESS CSP
|
Package: 30-WFBGA, CSPBGA |
Stock2,048 |
|
30-WFBGA, CSPBGA |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2S |
4.5 V ~ 20 V |
0°C ~ 70°C (TA) |
Direct Digital Amplification |
30-WFBGA, CSPBGA |
- |
||
STMicroelectronics |
IC DAS 2CH MICROLESS POWERSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3,659,988 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2S |
4.5 V ~ 20 V |
0°C ~ 70°C (TA) |
Direct Digital Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSO-36 |
||
STMicroelectronics |
IC DAS 2CH MICROLESS POWERSSO36
|
Package: - |
Stock227,220 |
|
- |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2S |
4.5 V ~ 20 V |
0°C ~ 70°C (TA) |
Direct Digital Amplification |
- |
- |
||
STMicroelectronics |
IC DAS 2CH MICROLESS FLIPCHIP
|
Package: 30-WFBGA, FCBGA |
Stock5,568 |
|
30-WFBGA, FCBGA |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2S |
4.5 V ~ 18 V |
0°C ~ 70°C (TA) |
Full Flexible Amplification |
30-WFBGA, FCBGA |
FlipChip 30 |
||
STMicroelectronics |
IC DAS 2CH MICROLESS FLIPCHIP
|
Package: 30-WFBGA, CSPBGA |
Stock4,752 |
|
30-WFBGA, CSPBGA |
Sound Terminal? |
- |
- |
- |
- |
- |
- |
- |
30-WFBGA, CSPBGA |
30-CSP (3.24x2.57) |
||
STMicroelectronics |
IC DAS 2CH MICROLESS POWERSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock1,984,812 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 20 V |
0°C ~ 70°C (TA) |
Direct Digital Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |
||
STMicroelectronics |
IC AUDIO SYS DGTL 2.1CH PWRSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock303,120 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 21.5 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |
||
STMicroelectronics |
IC AUDIO SYS DGTL 2.1CH PWRSSO36
|
Package: 36-FSOP (0.295", 7.50mm Width) Exposed Pad |
Stock414,660 |
|
36-FSOP (0.295", 7.50mm Width) Exposed Pad |
- |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
5 V ~ 26 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
36-FSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 |
||
STMicroelectronics |
SOUND TERMINAL 2.1-CHANNEL HIGH-
|
Package: 36-PowerFSOP (0.295", 7.50mm Width) |
Stock3,584 |
|
36-PowerFSOP (0.295", 7.50mm Width) |
Sound Terminal™ |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I²C, I²S |
5 V ~ 26 V |
-20°C ~ 85°C (TA) |
Full Flexible Amplification |
36-PowerFSOP (0.295", 7.50mm Width) |
PowerSSO-36 |
||
STMicroelectronics |
SOUND TERMINAL 2.1-CHANNEL HIGH-
|
Package: 36-PowerFSOP (0.295", 7.50mm Width) |
Stock3,456 |
|
36-PowerFSOP (0.295", 7.50mm Width) |
Sound Terminal™ |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I²C, I²S |
5 V ~ 26 V |
-20°C ~ 85°C (TA) |
Full Flexible Amplification |
36-PowerFSOP (0.295", 7.50mm Width) |
PowerSSO-36 |
||
STMicroelectronics |
IC AUDIO SYSTEM DGTL 36PWRSSO
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock9,840 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
5 V ~ 26 V |
-20°C ~ 85°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 |
||
STMicroelectronics |
IC AUDIO SYSTEM DGTL 36PWRSSO
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6,984 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
5 V ~ 26 V |
-20°C ~ 85°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 |
||
STMicroelectronics |
IC AUDIO SYS DGTL 2.1CH PWRSSO36
|
Package: 36-FSOP (0.295", 7.50mm Width) Exposed Pad |
Stock143,232 |
|
36-FSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 21.5 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
36-FSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |
||
STMicroelectronics |
IC AUDIO SYS DGTL 2.1CH PWRSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock3,904 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
5 V ~ 26 V |
-20°C ~ 85°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |
||
STMicroelectronics |
IC AUDIO SYSTEM 2.1 48-VQFN
|
Package: 48-VFQFN Exposed Pad |
Stock41,412 |
|
48-VFQFN Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 25.5 V |
0°C ~ 70°C (TA) |
Full Flexible Amplification |
48-VFQFN Exposed Pad |
48-VQFN (7x7) |
||
STMicroelectronics |
IC AUDIO SYSTEM 2.1 48-VQFN
|
Package: 48-VFQFN Exposed Pad |
Stock7,856 |
|
48-VFQFN Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 25.5 V |
0°C ~ 70°C (TA) |
Full Flexible Amplification |
48-VFQFN Exposed Pad |
48-VQFN (7x7) |
||
STMicroelectronics |
IC AUDIO SYSTEM 2.1 48-VQFN
|
Package: 48-VFQFN Exposed Pad |
Stock62,904 |
|
48-VFQFN Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 26 V |
0°C ~ 70°C (TA) |
Full Flexible Amplification |
48-VFQFN Exposed Pad |
48-VQFN (7x7) |
||
STMicroelectronics |
IC DAS 2.1 CHANNEL POWERSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock2,604,396 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 16 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |
||
STMicroelectronics |
IC DAS 2.1 CHANNEL POWERSSO36
|
Package: 36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Stock177,264 |
|
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
Sound Terminal? |
Fully Integrated Processor |
Pre-Amplifier |
2 |
I2C, I2S |
4.5 V ~ 16 V |
-20°C ~ 70°C (TA) |
Full Flexible Amplification |
36-BFSOP (0.295", 7.50mm Width) Exposed Pad |
PowerSSO-36 EPD |