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Sockets for ICs, Transistors

Records 52
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Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
Package: -
Stock4,032
-
XR2
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Carrier
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock8,568
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Carrier
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock5,436
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Carrier
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
Package: -
Stock7,956
-
XR2
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
-
Beryllium Copper
-
-
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
Package: -
Stock7,092
-
XR2
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC SOCKET 64POS
Package: -
Stock5,274
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock4,770
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock5,706
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock8,028
-
XR2
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock4,878
-
XR2
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock3,508
-
XR2
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock4,590
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock5,346
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 20POS GOLD
Package: -
Stock5,076
-
XR2
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock2,340
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
Package: -
Stock7,560
-
XR2
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 20POS GOLD
Package: -
Stock6,516
-
XR2
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 32POS GOLD
Package: -
Stock8,010
-
XR2
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock2,682
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock2,430
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,816
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock7,074
-
XR2
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock2,538
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock5,886
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock5,418
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock6,138
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 20POS GOLD
Package: -
Stock8,640
-
XR2
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock7,722
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 20POS GOLD
Package: -
Stock7,668
-
XR2
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock5,832
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C