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Sockets for ICs, Transistors

Records 234
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Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN SOCKET BGA CUSTOM
Package: -
Stock7,038
-
Textool?
BGA
Custom
0.026" ~ 0.050" (0.65mm ~ 1.27mm)
Custom
Custom
-
Through Hole
Custom
-
-
-
-
-
-
-
3M
CONN SOCKET BGA 49POS GOLD
Package: -
Stock3,580
-
Textool?
BGA
49 (Verification Required)
0.039" (1.00mm)
Gold
-
-
Through Hole
Closed Frame
-
-
-
-
-
-
-
3M
CONN SOCKET SIP 32POS GOLD
Package: -
Stock3,042
-
-
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
Through Hole
Closed Frame
-
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
-
-
3M
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock5,742
-
400
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
-
-
3M
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock7,758
-
400
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
-
-
3M
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock4,518
-
400
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
-
-
3M
CONN SOCKET SIP 32POS GOLD
Package: -
Stock8,262
-
300
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
Through Hole
Closed Frame
-
0.100" (2.54mm)
Gold
8µin (0.20µm)
-
-
-
3M
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock7,236
-
100
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock5,454
-
100
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock3,474
-
100
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock5,670
-
100
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 42POS GOLD
Package: -
Stock2,178
-
100
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock6,354
-
100
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock5,454
-
100
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock4,842
-
100
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock2,214
-
100
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock2,394
-
100
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock3,726
-
100
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock6,750
-
100
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock2,178
-
100
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock5,778
-
100
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,690
-
100
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock5,832
-
100
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock8,280
-
100
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock7,236
-
100
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock3,474
-
100
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock6,804
-
100
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock2,106
-
100
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock3,598
-
100
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock4,158
-
100
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C