* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Memory Type |
Memory Format |
Technology |
Memory Size |
Memory Interface |
Clock Frequency |
Write Cycle Time - Word, Page |
Access Time |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
1K 128X8 1.8V SERIAL EE IND
|
Package: SC-74A, SOT-753 |
Stock4,784 |
|
SC-74A, SOT-753 |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C |
400kHz |
5ms |
3.5µs |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
SC-74A, SOT-753 |
SOT-23-5 |
||
Microchip Technology |
512K 64KX8 1MHZ SER EE IND
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock4,480 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
512Kb (64K x 8) |
I²C |
1MHz |
5ms |
400ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
1MB SPI SRAM 2.5-5.5V
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,808 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Volatile |
SRAM |
SRAM - Synchronous, SDR |
1Mb (128K x 8) |
SPI - Quad I/O |
20MHz |
- |
- |
2.5V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
512K 64KX8 1MHZ SER EE IND
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock3,664 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
512Kb (64K x 8) |
I²C |
1MHz |
5ms |
400ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
1MB SPI SRAM 2.5-5.5V
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,608 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Volatile |
SRAM |
SRAM - Synchronous, SDR |
1Mb (128K x 8) |
SPI - Quad I/O |
16MHz |
- |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
512K 64KX8 1MHZ SER EE IND
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,256 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
512Kb (64K x 8) |
I²C |
1MHz |
5ms |
400ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
1MB SPI SRAM 2.5-5.5V
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,816 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Volatile |
SRAM |
SRAM - Synchronous, SDR |
1Mb (128K x 8) |
SPI - Quad I/O |
20MHz |
- |
- |
2.5V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock4,144 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
256Kb (32K x 8) |
I²C |
1MHz |
5ms |
400ns |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
64 KB SERIAL LOW POWER SRAM
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,184 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Volatile |
SRAM |
SRAM - Synchronous, SDR |
64Kb (8K x 8) |
SPI |
20MHz |
- |
- |
2.7V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
256K 32KX8 2.5V SER EE EXT
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock6,608 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
256Kb (32K x 8) |
I²C |
1MHz |
5ms |
400ns |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 1M PARALLEL 44SOJ
|
Package: 44-BSOJ (0.400", 10.16mm Width) |
Stock7,360 |
|
44-BSOJ (0.400", 10.16mm Width) |
- |
Volatile |
SRAM |
SRAM - Asynchronous |
1Mb (64K x 16) |
Parallel |
- |
10ns |
10ns |
4.5V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
44-BSOJ (0.400", 10.16mm Width) |
44-SOJ |
||
Microchip Technology |
64K 8KX8 1.8V SER EE EXT
|
Package: 8-WFDFN Exposed Pad |
Stock4,368 |
|
8-WFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
I²C |
400kHz |
5ms |
900ns |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-WFDFN Exposed Pad |
8-TDFN (2x3) |
||
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock13,440 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
4Kb (256 x 8 x 2) |
I²C |
1MHz |
5ms |
450ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
32K 4KX8 1.8V SERIAL EE EXT
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock7,552 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
32Kb (4K x 8) |
I²C |
100kHz |
5ms |
3.5µs |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Winbond Electronics |
IC SDRAM 2GBIT 96WBGA
|
Package: 96-VFBGA |
Stock2,368 |
|
96-VFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
2Gb (128M x 16) |
Parallel |
800MHz |
- |
20ns |
1.283V ~ 1.45V |
-40°C ~ 105°C (TC) |
Surface Mount |
96-VFBGA |
96-VFBGA (7.5x13) |
||
Microchip Technology |
16K 2KX8 1.8V SERIAL EE
|
Package: 8-VFDFN Exposed Pad |
Stock3,216 |
|
8-VFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
100kHz |
5ms |
3.5µs |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-VFDFN Exposed Pad |
8-DFN (2x3) |
||
Winbond Electronics |
IC SDRAM 2GBIT 96WBGA
|
Package: 96-VFBGA |
Stock5,072 |
|
96-VFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
2Gb (128M x 16) |
Parallel |
667MHz |
- |
20ns |
1.425V ~ 1.575V |
-40°C ~ 105°C (TC) |
Surface Mount |
96-VFBGA |
96-VFBGA (7.5x13) |
||
Microchip Technology |
16KBIT AA 2-WIRE SERIAL EEPROM
|
Package: SC-74A, SOT-753 |
Stock5,584 |
|
SC-74A, SOT-753 |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
100kHz |
5ms |
3.5µs |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
SC-74A, SOT-753 |
SOT-23-5 |
||
Winbond Electronics |
IC SDRAM 2GBIT 96WBGA
|
Package: 96-VFBGA |
Stock2,096 |
|
96-VFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
2Gb (128M x 16) |
Parallel |
800MHz |
- |
20ns |
1.425V ~ 1.575V |
-40°C ~ 105°C (TC) |
Surface Mount |
96-VFBGA |
96-VFBGA (7.5x13) |
||
Microchip Technology |
16K I2C SERIAL EEPROM
|
Package: 8-VFDFN Exposed Pad |
Stock6,416 |
|
8-VFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
100kHz |
5ms |
3.5µs |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-VFDFN Exposed Pad |
8-DFN (2x3) |
||
Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA
|
Package: 96-TFBGA |
Stock3,792 |
|
96-TFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
1Gb (64M x 16) |
Parallel |
800MHz |
- |
20ns |
1.425V ~ 1.575V |
-40°C ~ 95°C (TC) |
Surface Mount |
96-TFBGA |
96-WBGA (9x13) |
||
Microchip Technology |
128K 16KX8 1.7V SER EE IND
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock2,448 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
I²C |
400kHz |
5ms |
900ns |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA
|
Package: 96-TFBGA |
Stock2,304 |
|
96-TFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
1Gb (64M x 16) |
Parallel |
667MHz |
- |
20ns |
1.425V ~ 1.575V |
0°C ~ 85°C (TC) |
Surface Mount |
96-TFBGA |
96-WBGA (9x13) |
||
Microchip Technology |
128K 16KX8 1.7V SER EE
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,064 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
I²C |
400kHz |
5ms |
900ns |
1.7V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
8-MSOP |
||
Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA
|
Package: 96-TFBGA |
Stock4,336 |
|
96-TFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
1Gb (64M x 16) |
Parallel |
800MHz |
- |
20ns |
1.425V ~ 1.575V |
0°C ~ 85°C (TC) |
Surface Mount |
96-TFBGA |
96-WBGA (9x13) |
||
Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA
|
Package: 96-TFBGA |
Stock4,048 |
|
96-TFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3 |
1Gb (64M x 16) |
Parallel |
933MHz |
- |
20ns |
1.425V ~ 1.575V |
0°C ~ 85°C (TC) |
Surface Mount |
96-TFBGA |
96-WBGA (9x13) |
||
Microchip Technology |
1KB I2C EEPROM 1MHZ 1.7-5.5V 8-T
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock18,678 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C |
1MHz |
5ms |
450ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
1KB I2C EEPROM 1MHZ 1.7-5.5V 8-S
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock23,664 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C |
1MHz |
5ms |
450ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Alliance Memory, Inc. |
DDR3 512M X 16 96-BALL FBGA
|
Package: 96-TFBGA |
Stock7,632 |
|
96-TFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3L |
8Gb (512M x 16) |
Parallel |
933MHz |
- |
20ns |
1.275V ~ 1.425V |
-40°C ~ 95°C (TC) |
Surface Mount |
96-TFBGA |
96-FBGA (9x13.5) |
||
Alliance Memory, Inc. |
DDR3 512M X 16 96-BALL FBGA
|
Package: 96-TFBGA |
Stock6,640 |
|
96-TFBGA |
- |
Volatile |
DRAM |
SDRAM - DDR3L |
8Gb (512M x 16) |
Parallel |
933MHz |
- |
20ns |
1.275V ~ 1.425V |
0°C ~ 95°C (TC) |
Surface Mount |
96-TFBGA |
96-FBGA (9x13.5) |