* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Circuits |
Ratio - Input:Output |
Differential - Input:Output |
Input |
Output |
Frequency - Max |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLOCK BUFFER 1:1 160MHZ DIE
|
Package: Die |
Stock4,288 |
|
Die |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
160MHz |
2.97 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
Die |
Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
Package: Die |
Stock5,376 |
|
Die |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
125MHz |
2.97 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
Die |
Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
Package: Die |
Stock4,688 |
|
Die |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
125MHz |
2.97 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
Die |
Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
Package: Die |
Stock2,608 |
|
Die |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
125MHz |
2.97 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
Die |
Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 200MHZ DIE
|
Package: Die |
Stock2,064 |
|
Die |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
200MHz |
2.97 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
Die |
Die |
||
Microchip Technology |
IC CLOCK BUFFER 1:1 200MHZ DIE
|
Package: Die |
Stock4,800 |
|
Die |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
200MHz |
2.97 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
Die |
Die |
||
AKM Semiconductor Inc. |
IC CLK BUFFER 2:4 20TSSOP
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock6,448 |
|
20-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution), Multiplexer |
1 |
2:4 |
No/Yes |
LVCMOS, LVTTL |
LVPECL |
266MHz |
3.135 V ~ 3.465 V |
-40°C ~ 85°C |
Surface Mount |
20-TSSOP (0.173", 4.40mm Width) |
20-TSSOP |
||
Microchip Technology |
IC CLK MULTPLX
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock3,232 |
|
16-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
170MHz |
2.97 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
Microchip Technology |
IC CLK MULTPLX
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock7,312 |
|
16-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:1 |
No/Yes |
Crystal |
LVPECL |
170MHz |
2.97 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
Package: 6-UFDFN Exposed Pad |
Stock3,792 |
|
6-UFDFN Exposed Pad |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
No/No |
Crystal |
LVCMOS |
40MHz |
1.62 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
6-UFDFN Exposed Pad |
6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
Package: - |
Stock7,920 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
Package: - |
Stock4,864 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock7,344 |
|
16-WFQFN Exposed Pad |
- |
Fanout Buffer (Distribution), Multiplexer |
1 |
2:4 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
1GHz |
2.375 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
16-WFQFN Exposed Pad |
16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
Package: 16-WFQFN Exposed Pad |
Stock3,872 |
|
16-WFQFN Exposed Pad |
- |
Fanout Buffer (Distribution), Multiplexer |
1 |
2:4 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
1GHz |
2.375 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
16-WFQFN Exposed Pad |
16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 32LQFP
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,632 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
1GHz |
2.375 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
Package: 32-LQFP Exposed Pad |
Stock4,896 |
|
32-LQFP Exposed Pad |
- |
Fanout Buffer (Distribution), Multiplexer |
1 |
2:10 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
700MHz |
2.375 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
32-LQFP Exposed Pad |
32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1GHz
|
Package: 16-WFQFN Exposed Pad |
Stock5,824 |
|
16-WFQFN Exposed Pad |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
CMOS, LVDS, Sine Wave, TTL |
PECL |
1GHz |
2.5 V ~ 3.3 V |
0°C ~ 70°C |
Surface Mount |
16-WFQFN Exposed Pad |
16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 40MHZ
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,184 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:3 |
No/No |
Crystal |
LVCMOS |
40MHz |
1.62 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1GHZ
|
Package: 16-WFQFN Exposed Pad |
Stock2,224 |
|
16-WFQFN Exposed Pad |
- |
Buffer/Driver |
1 |
1:1 |
No/Yes |
CMOS, LVDS, Sine Wave, TTL |
PECL |
1GHz |
2.5 V ~ 3.3 V |
0°C ~ 70°C |
Surface Mount |
16-WFQFN Exposed Pad |
16-QFN (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 14GHZ 16SMD
|
Package: 16-VFCQFN Exposed Pad |
Stock6,256 |
|
16-VFCQFN Exposed Pad |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
Yes/Yes |
CML |
CML |
14GHz |
3 V ~ 3.6 V |
-40°C ~ 85°C |
Surface Mount |
16-VFCQFN Exposed Pad |
16-CSMT (3x3) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 14GHZ 16SMD
|
Package: 16-VFCQFN Exposed Pad |
Stock6,912 |
|
16-VFCQFN Exposed Pad |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
Yes/Yes |
CML |
CML |
14GHz |
3 V ~ 3.6 V |
-40°C ~ 85°C |
Surface Mount |
16-VFCQFN Exposed Pad |
16-CSMT (3x3) |
||
Maxim Integrated |
IC CLK BUFFER 1:15 52TQFP
|
Package: 52-TQFP |
Stock3,328 |
|
52-TQFP |
- |
Clock/Data Driver |
1 |
1:15 |
Yes/Yes |
LVECL, LVPECL |
LVECL, LVPECL |
1GHz |
2.375 V ~ 3.8 V |
-40°C ~ 85°C |
Surface Mount |
52-TQFP |
52-TQFP (10x10) |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock2,496 |
|
20-TSSOP (0.173", 4.40mm Width) |
Precision Edge? |
Fanout Buffer (Distribution), Multiplexer |
1 |
2:4 |
No/Yes |
LVCMOS, LVTTL |
LVPECL |
235MHz |
3.135 V ~ 3.465 V |
-40°C ~ 85°C |
Surface Mount |
20-TSSOP (0.173", 4.40mm Width) |
20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,304 |
|
8-SOIC (0.154", 3.90mm Width) |
Precision Edge? |
Fanout Buffer (Distribution) |
1 |
1:4 |
No/No |
LVCMOS, LVTTL |
LVCMOS, LVTTL |
200MHz |
3 V ~ 3.6 V |
-40°C ~ 85°C |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 16QFN
|
Package: 16-VFQFN Exposed Pad |
Stock2,032 |
|
16-VFQFN Exposed Pad |
- |
Fanout Buffer (Distribution), Multiplexer |
1 |
3:4 |
No/Yes |
LVCMOS, LVTTL |
LVPECL |
266MHz |
2.375 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
16-VFQFN Exposed Pad |
16-QFN (3.5x3) |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 20TSSOP
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock10,764 |
|
20-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution), Multiplexer |
1 |
3:4 |
No/Yes |
LVCMOS, LVTTL |
LVPECL |
266MHz |
2.375 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
20-TSSOP (0.173", 4.40mm Width) |
20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock41,520 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
1GHz |
2.375 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock2,864 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
1GHz |
2.375 V ~ 3.63 V |
-40°C ~ 85°C |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock6,528 |
|
8-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:2 |
Yes/Yes |
CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL |
LVPECL |
1GHz |
2.375 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:6 40MHZ 16TSSOP
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock5,424 |
|
16-TSSOP (0.173", 4.40mm Width) |
- |
Fanout Buffer (Distribution) |
1 |
1:6 |
No/No |
Crystal |
LVCMOS |
40MHz |
1.62 V ~ 3.63 V |
0°C ~ 70°C |
Surface Mount |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |